Folgen
Ikjoo Byun
Ikjoo Byun
Bestätigte E-Mail-Adresse bei samsung.com - Startseite
Titel
Zitiert von
Zitiert von
Jahr
Transfer of thin Au films to polydimethylsiloxane (PDMS) with reliable bonding using (3-mercaptopropyl) trimethoxysilane (MPTMS) as a molecular adhesive
I Byun, AW Coleman, B Kim
Journal of micromechanics and microengineering 23 (8), 085016, 2013
1462013
Cost-effective laser interference lithography using a 405 nm AlInGaN semiconductor laser
I Byun, J Kim
Journal of Micromechanics and Microengineering 20 (5), 055024, 2010
892010
Micro-heaters embedded in PDMS fabricated using dry peel-off process
I Byun, R Ueno, B Kim
Microelectronic engineering 121, 1-4, 2014
232014
Synthesis of laminated alumina films by AC oxidation
H Segawa, H Okano, K Wada, S Inoue, I Byun
Journal of The Electrochemical Society 160 (6), D240, 2013
132013
SAM meets MEMS: reliable fabrication of stable Au-patterns embedded in PDMS using dry peel-off process
I Byun, AW Coleman, B Kim
Microsystem technologies 20, 1783-1789, 2014
122014
Elucidating the mechanism of the considerable mechanical stiffening of DNA induced by the couple Zn2+/Calix[4]arene-1,3-O-diphosphorous acid
Y Tauran, MC Tarhan, L Mollet, JB Gerves, M Kumemura, L Jalabert, ...
Scientific Reports 8 (1), 1226, 2018
92018
Microcontact printing using a flat metal-embedded stamp fabricated using a dry peel-off process
I Byun, AW Coleman, B Kim
RSC Advances 3 (47), 24872-24876, 2013
72013
Fabrication of three-dimensional PDMS microstructures by selective bonding and cohesive mechanical failure
I Byun, B Kim
Microelectronic engineering 121, 92-95, 2014
62014
Fabrication of PDMS nano-stamp by replicating Si nano-moulds fabricated by interference lithography
I Byun, JH Park, JW Kim, BJ Kim
Key Engineering Materials 516, 25-29, 2012
52012
Transfer Methods of PZT Thin Capacitor to Flexible Polymer by Self‐Assembled Monolayers
Y Mizuno, I Byun, B Kim, M Ichiki
Electronics and Communications in Japan 99 (10), 96-102, 2016
32016
Microcontact printing using flexible flat PDMS stamps with metal embedment
I Byun, J Park, B Kim
2012 IEEE Nanotechnology Materials and Devices Conference (NMDC2012), 30-33, 2012
32012
In-home relay device and electronic device connected thereto
B Ikjoo, M Kyoungjin, YOO Hyunseok, LEE Myunghwan, WOO Jongbum
US Patent App. 17/674,887, 2022
12022
Fabrication of micro-heaters embedded in PDMS using a dry peel-off process
I Byun, R Ueno, B Kim
2014 IEEE 27th International Conference on Micro Electro Mechanical Systems …, 2014
12014
Method for detecting and controlling battery status by using sensor, and electronic device using same
DU Jeong, SG Lee, DU Kwak, MH Park, HC Park, SG Bae, IJ Byun, ...
US Patent 11,733,303, 2023
2023
Method and electronic device for correcting and generating data related to outside air on basis of movement
D Jeong, K Donguk, M Park, H Park, BAE Sunggun, B Ikjoo, SEO Hyejung, ...
US Patent 11,549,927, 2023
2023
Electronic device comprising earphone jack integrally formed with gas sensor
BK Sim, JG Jo, SG Kang, IJ Byun, HK Yun, JH Lim, DI Son
US Patent 11,533,394, 2022
2022
Portable apparatus for measuring air quality and method for displaying information about air quality
H Park, YIM Changyong, B Ikjoo, S Je
US Patent 11,467,146, 2022
2022
Electronic device and method for controlling operation thereof
LEE Taehan, BAE Sunggun, S Park, H Park, B Ikjoo
US Patent 11,172,450, 2021
2021
Electronic device including replaceable sensor
DU Kwak, MH Park, HC Park, SG Bae, IJ Byun, SG Lee, DU Jeong, ...
US Patent 11,169,130, 2021
2021
Gas sensor module for electronic device and electronic device comprising same
MH Park, SG Lee, DU Kwak, HC Park, SG Bae, IJ Byun, DU Jeong, ...
US Patent App. 16/758,925, 2020
2020
Das System kann den Vorgang jetzt nicht ausführen. Versuchen Sie es später erneut.
Artikel 1–20